The ARM 9 System on Module is an ultra-compact processor board based on the NXP LPC3250 microcontroller. It is designed for low-power, high-performance embedded applications requiring rich peripheral connectivity and advanced power management.
Features
- LPC3250 ARM926EJ-S Processor @ 266 MHz
- High-speed DDR2 SDRAM & NAND Flash
- Integrated Color LCD Controller
- Vector Floating Point (VFP) Co-processor
- Multiple UART, SPI, and I2C interfaces
- Display & Graphics: Programmable color LCD controller supports up to a TFT interface
- Touch screen: Integrated touch screen controller
- Network Support: 10/100 Base-T Ethernet PHY
- PC Interface: One USB 2.0 high-speed On-the-Go interface
- Serial Interfaces: Up to four external UARTs
- CAN 2.0B controller | Three I2C ports | Three SPI ports
- GPIO: Programmable I/O depending on peripheral requirements
- Mechanical: 60 mm wide x 60 mm long x 5.4 mm high
Applications
- ATE | Data Acquisition System | Process Control Industries | Industrial Automation
- Embedded Systems & Mobile Handhelds
Environmental Conditions
- Operating Temperature: 0°C to 50°C
- Storage Temperature: -40°C to +85°C
- Humidity: 90% Relative (Non-condensing)