Meltronics provides world-class PCB assembly services, utilizing state-of-the-art automated SMT lines and skilled manual thru-hole assembly. Our facility is optimized for the production of complex, high-reliability electronic modules used in aeronautics, naval systems, and ground defense platforms. We handle everything from prototyping to medium-volume production runs with total quality control.
Technical Capabilities
- SMT Assembly: Automated placement of components down to 01005 and 0.3mm pitch BGA
- Thru-Hole Assembly: Precision manual and wave soldering for ruggedized components
- Complex Boards: Rigid, Flex, and Rigid-Flex multi-layer assembly
- Specialized Processes: Underfill, PoP (Package on Package), and Press-fit connectors
Quality Control
- In-line AOI: Automated Optical Inspection for real-time defect detection
- X-Ray Inspection: 3D X-Ray for BGA and hidden joint verification
- Conformal Coating: Automated coating for moisture and vibration protection
- Testing: ICT (In-Circuit Test) and Functional Testing (FCT) capability